CMP Utility Systems
The CMP (Chemical Mechanical Polishing) Process is highly important process for semiconductor manufacturing. We have many years of providing slurry and chemical blending and supply systems especially for this key process.
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CMP Slurry Supply System
This system has a parallel vessel system to secure stable operation and accurate blending of slurry and oxidizer. Available options include an Automatic Titration System and accommodations for different type of slurries.
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Chemical Flow Control System
This system is suitable for in-line blending of CMP slurries, and provides precisely controlled constant flow of chemicals between 50 to 1,000ml/min.
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Automatic Titration & Replenishment System
The Automatic Titration & Replenishment System monitors the H2O2 concentration of CMP slurry and maintains it within a specific range. Potentiometric titration system with an automatic sampling enables accurate analysis.
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DIW Booster Pump System
This system boosts up DIW pressure to meet required pressure of process equipment.