Copper Electroplating Utility Systems
The Copper Electroplating Process is also an important process for semiconductor manufacturing. We support chemical utility of Copper Electroplating Equipment.
Chemical Supply System
This system supplies electroplating solution from 200L drum to Copper Electroplating Equipment and Analyzer.
Specification
| Dimension | W2000×D1000×H2000 |
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| Distribution Capacity | 15L/min X 2 lines @ 0.4MPa |
Function
| Drum Cabinet | Capacity : one 200L drum |
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| Pressure Vessel |
・Legally Approved |
Chemical Recovery System
This system recovers electroplating solution drained from Copper Electroplating Equipment and Analyzer to 200L drum.
Specification
| Dimension | W2000×D1000×H2000 |
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Function
| Drum Cabinet | ・Capacity : two 200L drums ・Function : a) Auto switchover between two drums |
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