The CMP (Chemical Mechanical Polishing) Process is highly important process for semiconductor manufacturing. We have many years of providing slurry and chemical blending and supply systems especially for this key process.
This system has a parallel vessel system to secure stable operation and accurate blending of slurry and oxidizer.
Available options include an Automatic Titration System and accommodations for different type of slurries.
The Automatic Titration & Replenishment System monitors the H2O2 concentration of CMP slurry and maintains it within a specific range. Potentiometric titration system with an automatic sampling enables accurate analysis.