The Copper Electroplating Process is also an important process for semiconductor manufacturing. We support chemical utility of Copper Electroplating Equipment.
This system supplies electroplating solution from 200L drum to Copper Electroplating Equipment and Analyzer.
|Distribution Capacity||15L/min X 2 lines @ 0.4MPa|
|Drum Cabinet||Capacity : one 200L drum|
・Capacity: 100L （gross weight: approx. 130Kg）
・Maximum Capable Pressure: 0.45MPa
This system recovers electroplating solution drained from Copper Electroplating Equipment and Analyzer to 200L drum.
・Capacity : two 200L drums
・Function : a) Auto switchover between two drums